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ATS-X51230R-C1-R0

Name: Advanced Thermal Solutions ATS-X51230R-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-X51230R-C1R0
Price: 40.08 SGD
Availability: OutOfStock

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Mouser No:

984-ATS-X51230R-C1R0

Mfr. No:

ATS-X51230R-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Heat Sink+superGRIP Attachment, Low Profile, T766, 22.25x22.25x19.5mm

Datasheet:

ATS-X51230R-C1-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-X51230R-C1-R0

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 8 Weeks Estimated factory production time.

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Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$40.08	$40.08
	$36.36	$363.60
	$34.09	$681.80
	$32.56	$1,628.00
	$31.37	$3,137.00
	$29.89	$5,978.00
	$29.23	$14,615.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Heatsink Material:	Aluminum
Fin Style:	maxiFLOW
Length:	22.25 mm
Width:	22.25 mm
Height:	19.5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	superGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW superGRIP

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Datasheet

ATS-X51230R-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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USHTS:: 7616995190
MXHTS:: 7616995195
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.