MCQ1V3216-R560-R

Eaton Electronics
704-MCQ1V3216-R560-R
MCQ1V3216-R560-R

Mfr.:

Description:
RF Inductors - SMD Multi H Q,IND 560nH Q30 150mA 2PADS SMT

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
24 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (SGD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$0.215 $0.22
$0.094 $0.94
$0.084 $2.10
$0.073 $7.30
$0.066 $16.50
$0.056 $56.00
Full Reel (Order in multiples of 4000)
$0.04 $160.00
† A MouseReel™ fee of $10.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
Eaton
Product Category: RF Inductors - SMD
RoHS:  
1206 (3216 metric)
Shielded
560 nH
10 %
150 mA
500 mOhms
- 40 C
+ 85 C
30
115 MHz
Standard
3.2 mm
1.6 mm
0.9 mm
MCQ1V
Reel
Cut Tape
MouseReel
Application: Commercial
Brand: Eaton Electronics
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 4000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Test Frequency: 25 MHz
Unit Weight: 30 mg
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Attributes selected: 0

Datasheet

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CNHTS:
8504500000
USHTS:
8504508000
ECCN:
EAR99

MCQ1V Multilayer Chip Inductors

Eaton Electronics MCQ1V Multilayer Chip Inductors deliver design flexibility in RF wireless applications. These inductors offer noise filtering, impedance matching, and resonance setting for high-frequency wireless circuits. Other features include a small footprint, high Q performance, tight inductance tolerance, and high current handling capability. The MCQ1V Multilayer Chip Inductors are ideally suited for consumer, energy, industrial, computing, and medical applications.

5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

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