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S80KS5122GABHI020

Name: Infineon S80KS5122GABHI020
Brand: Infineon Technologies
SKU: 727-S5122GABHI020
Price: 14.03 SGD
Availability: OutOfStock

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Mouser No:

727-S5122GABHI020

Mfr. No:

S80KS5122GABHI020

Mfr.:

Infineon Technologies

Description:

DRAM SPCM

Datasheet:

S80KS5122GABHI020 Datasheet (PDF)

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Availability

Stock:: 0

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On Order:: 338
Factory Lead Time:: 26

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

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Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$14.03	$14.03
	$13.04	$130.40
	$12.31	$307.75
	$12.04	$602.00
	$11.24	$3,799.12

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	DRAM
RoHS:
Type:	HyperRAM
Memory Size:	512 Mbit
Data Bus Width:	8 bit
Maximum Clock Frequency:	200 MHz
Package/Case:	FBGA-24
Organisation:	64 M x 8
Access Time:	35 ns
Supply Voltage - Min:	1.7 V
Supply Voltage - Max:	2 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Infineon Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TH
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Product Type:	DRAM
Factory Pack Quantity:	338
Subcategory:	Memory & Data Storage
Supply Current - Max:	44 mA

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Datasheet

S80KS5122GABHI020 Datasheet (PDF)

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CNHTS:: 8542329010
USHTS:: 8542320032
ECCN:: 3A991.b.2

S80KS5122 & S80KS5123 HYPERRAM™ 2.0 Memory

Infineon Technologies S80KS5122 and S80KS5123 HYPERRAM™ 2.0 Memory is a high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory for scratchpad or buffering purposes. HYPERRAM products support JEDEC JESD251 profile compliant HYPERBUS™ and Octal xSPI interfaces that draw upon the legacy features of both parallel and serial interface memories while enhancing system performance and ease of design as reducing system cost. The low-pin count architecture makes HYPERRAM especially suitable for power and board space-constrained applications requiring off-chip external RAM.