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EBTM-4-08-2.0-S-VT-1-R

Name: Samtec EBTM-4-08-2.0-S-VT-1-R
Brand: Samtec
SKU: 200-EBTM4082.0SVT1R
Price: 31.59 SGD
Availability: InStock

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Mouser No:

200-EBTM4082.0SVT1R

Mfr. No:

EBTM-4-08-2.0-S-VT-1-R

Mfr.:

Samtec

Description:

High Speed/Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header

Datasheet:

EBTM-4-08-2.0-S-VT-1-R Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec EBTM-4-08-2.0-S-VT-1-R

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Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$31.59	$31.59
	$28.87	$288.70
	$26.38	$791.40
	$24.11	$1,446.60
	$21.88	$2,625.60
	$20.12	$5,432.40
	$18.50	$9,435.00
	$16.82	$17,156.40

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	64 Position
Number of Rows:	8 Row
Pitch:	2 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	EBTM
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Current Rating:	4.2 A
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	30
Subcategory:	Backplane Connectors
Tradename:	ExaMAX

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Datasheet

EBTM-4-08-2.0-S-VT-1-R Datasheet (PDF)

Models

EBTM-4-08-2.0-S-VT-1-R Symbol & Footprint by SnapMagic

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.