It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

HDTM-4-04-1-S-VT-0-2

Images are for reference only
See Product Specifications

Mouser No:

200-HDTM4041SVT02

Mfr. No:

HDTM-4-04-1-S-VT-0-2

Mfr.:

Samtec

Description:

High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-4-04-1-S-VT-0-2 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Samtec HDTM-4-04-1-S-VT-0-2

Delivery Restriction:

Mouser does not presently sell this product in your region.

Availability

Stock:: An unexpected error occurred. Please try again later.

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Delivery Restriction:	Mouser does not presently sell this product in your region.
Product:	Headers
Number of Positions:	32 Position
Number of Rows:	4 Row
Pitch:	1.8 mm
Termination Style:	Solder Pin
Packaging:	Tray
Brand:	Samtec
Contact Material:	Phosphor Bronze
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1.5 A
Housing Material:	Liquid Crystal Polyer (LCP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Vertical
Orientation:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	60
Subcategory:	Backplane Connectors
Voltage Rating:	48 VAC

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

HDTM-4-04-1-S-VT-0-2 Datasheet (PDF)

USHTS:: 8536694040
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.