Description:

Thermal Interface Products WX300901310 3M(TM) THERMALLY COND INTERFACE PAD 5591, 210MM X 300MM 2.5MM

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$48.19	$48.19
	$44.92	$449.20
	$42.13	$842.60
	$41.23	$2,061.50
	$39.73	$3,973.00
	$34.81	$6,962.00
1,000	Quote

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	3M
Product Category:	Thermal Interface Products
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Thermally Conductive Tape
Package/Case:	Non-standard
Material:	Silicone Elastomer
Thermal Conductivity:	1 W/m-K
Color:	White
Minimum Operating Temperature:	- 50 C
Maximum Operating Temperature:	+ 125 C
Length:	210 mm
Width:	300 mm
Thickness:	2.5 mm
Flammability Rating:	UL 94 V-0
Series:	5591
Brand:	3M Electronic Specialty
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	KR
Product Type:	Thermal Interface Products
Factory Pack Quantity:	10
Subcategory:	Thermal Management
Part # Aliases:	5591 08806080063735 7010321481
Unit Weight:	284.634 g

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

5591-25 Datasheet (PDF)

CNHTS:: 3824999999
USHTS:: 3919905060
ECCN:: EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.