All Results (1,252)

Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Bergquist Company Thermal Interface Products Gap Filler, 2-Part, Sil-Free, Room Temp Cure, 3W/mK, 200ml Cartridge, TGF3000SF Drop Dispatch Lead Time 4 Weeks
Min.: 6
Mult.: 1

Bergquist Company Thermal Interface Products Gap Filler, 2-Part, Sil-Free, Room Temp Cure, 3W/mK, 7 Gallon Pail, TGF3000SF Drop Dispatch Lead Time 4 Weeks
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.100" Thickness, TGP10000ULM, IDH 2599712 Drop Dispatch Lead Time 6 Weeks
Min.: 2
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP10000ULM, IDH 2599713 Drop Dispatch Lead Time 5 Weeks
Min.: 2
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 7W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP7000ULM, IDH 2474886 3In Stock
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products Thermal Interface Compound for Copper-Based Heat Sinks, 0.5CC Syringe, TGR 4000 Drop Dispatch Lead Time 5 Weeks
Min.: 50
Mult.: 1

Bergquist Company Thermal Interface Products Thermal Interface Compound for Copper Heat Sink, 25CC Syringe, TGR 4000/4000 Drop Dispatch Lead Time 5 Weeks
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products Thermal Interface Compound for Copper-Based Heat Sinks, 5CC Syringe, TGR 4000 Drop Dispatch Lead Time 6 Weeks
Min.: 3
Mult.: 1

Bergquist Company Thermal Interface Products Silicon Adhesive Sealant, 10 Gallon Kit, Liqui-Bond TLB400SLT Drop Dispatch Lead Time 4 Weeks
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products Silicon Adhesive Sealant, 400CC Cartridge, Liqui-Bond TLB400SLT Drop Dispatch Lead Time 3 Weeks
Min.: 3
Mult.: 1

Bergquist Company Thermal Interface Products Silicon Adhesive Sealant, Adaptable Cure Profile, 1200CC Kit, Liqui-Bond Drop Dispatch Lead Time 3 Weeks
Min.: 4
Mult.: 1

Bergquist Company Thermal Interface Products Thermally Conductive Gel Interface Material, 10 W/m-K, 0.8 Gallon Pail Drop Dispatch Lead Time 3 Weeks
Min.: 25
Mult.: 1

Bergquist Company Thermal Interface Products Thermally Conductive Gel for Data & Telecom Market, 10 W/m-K, 30CC Syringe Drop Dispatch Lead Time 12 Weeks
Min.: 50
Mult.: 1

Bergquist Company Thermal Interface Products Conductive, 1-Part, Cure Gel Sil-Free Material, 4.5 W/m-K, 150CC, Liqui-Form Drop Dispatch Lead Time 3 Weeks
Min.: 7
Mult.: 1

Bergquist Company Thermal Interface Products Conductive, 1-Part, Cure Gel Sil-Free Material, 4.5 W/m-K, 300CC, Liqui-Form Drop Dispatch Lead Time 3 Weeks
Min.: 4
Mult.: 1


Bergquist Company Thermal Interface Products Original Sil-Pad Material, 0.007" Thickness, 1 Side Adhesive, Sil-Pad TSP900/400 Drop Dispatch Lead Time 7 Weeks
Min.: 1,429
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Factory Drop Ship
Min.: 6
Mult.: 1
Bergquist Company Thermal Interface Products Laminate Material - Silicone, High Durability, Bond-Ply TBP 1400LMS-HD/LMS-HD Drop Dispatch Lead Time 13 Weeks
Min.: 1
Mult.: 1
Bergquist Company Thermal Interface Products Laminate Material - Silicone, High Durability, Bond-Ply TBP 1400LMS-HD/LMS-HD Drop Dispatch Lead Time 13 Weeks
Min.: 34
Mult.: 1
Bergquist Company Thermal Interface Products 1-Part, Cure Gel Material, 5 Gallon, 3.5W/m-K, Liqui-Form TLF3500CGEL/3500 CGEL Factory Drop Ship
Min.: 25
Mult.: 1
Bergquist Company Thermal Interface Products 1-Part, Cure Gel Material, 5 Gallon, 3.5W/m-K, Liqui-Form TLF3500CGEL/3500 CGEL Factory Drop Ship
Min.: 25
Mult.: 1
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.040" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 5
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.060" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 4
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.080" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 3
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.100" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 3
Mult.: 1