MPCI-L210-63S
See Product Specifications
Mfr.:
Description:
Mobile Modules LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Availability
-
Stock:
-
Non-StockedAn unexpected error occurred. Please try again later.
-
Factory Lead Time:
Pricing (SGD)
| Qty. | Unit Price |
Ext. Price
|
|---|---|---|
| $141.93 | $22,708.80 |
Datasheet
- USHTS:
- 8517620090
- TARIC:
- 8517620000
Singapore
