Vishay / Sfernice MEPIC Thin Film Resistors

Vishay/Sfernice Massive Electro-Pyrotechnic Initiator Chip (MEPIC) Thin Film Resistors are the Surface Mount Device (SMD) variants designed for pyrotechnic applications. These resistors convert electrical energy into heat in a precise electro-thermal profile to initiate a series of pyrotechnic events in a controlled energetic reaction. The standard case geometry (SMD) enables the implementation of the assembly process used in the electronic component industry to provide high productivity. The MEPIC SMD resistors feature firing energy down to 1.0mJ, firing time down to 250μs, and Joule effect ignition. These resistors are specifically designed to offer an alternative to Bridge Wire (BW) technology with the same level of performance. Typical applications include mining, demolition, and fireworks.

The MEPIC active area gets impregnated with a primary pyrotechnic material to ensure intimate contact for an optimum heat transfer of thermal energy. The two main characteristics of MEPIC resistors are “All Fire” (AF) and “No Fire” (NF) performances. The AF represents the command pulse, where the dissipated energy will be transferred to the primer to generate the ignition. The NF represents the immunity of the resistor with primer to the environmental electromagnetic pollution and electric continuity test.

Features

  • Surface mount design for standard assembly process
  • SMD case size 0805 version only
  • Active area is designed for precise performances
  • Compatibility with pyrotechnic elements has to be tested in a real environment
  • Firing energy down to 1mJ
  • Firing time down to 250μs
  • 2Ω to 8Ω ± 10% (typical) Ohmic value
  • Joule effect ignition
  • Easy set up by the design of firing levels available
  • Very predictable, reproducible, and reliable behavior

Applications

  • Mining/electronic detonators
  • Demolition/digital blasting
  • Fireworks/e-match
  • Pyrotechnic

Dimension Diagram

Mechanical Drawing - Vishay / Sfernice MEPIC Thin Film Resistors
Published: 2024-04-15 | Updated: 2024-05-08