eMMC

Results: 529
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Package/Case Memory Size Configuration Sequential Read Sequential Write Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
SkyHigh Memory S40FC004C1B2I003A3
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 9.0 x 7.5 x 0.8 mm LPF/W with reel packing Non-Stocked Lead-Time 22 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 85 C Reel
SkyHigh Memory S40FC008C1B1C00000
SkyHigh Memory eMMC 8GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm Non-Stocked Lead-Time 22 Weeks
Min.: 171
Mult.: 171

FBGA-153 Tray
SkyHigh Memory S40FC008C1B1I00000
SkyHigh Memory eMMC 8GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm Non-Stocked Lead-Time 22 Weeks
Min.: 171
Mult.: 171

FBGA-153 Tray
SkyHigh Memory S40FC016C3B1B00000
SkyHigh Memory eMMC 16GB FBGA 13 x 11.5 x 0.8 mm Auto temp.(-40-105C) Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
Tray
SkyHigh Memory S40FC016C3B1I00001
SkyHigh Memory eMMC 16GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm Industrial Grade F/W with tray packing- Customer Sag. Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
SkyHigh Memory S40FC016C3B1I00002
SkyHigh Memory eMMC Lab: 16GB e.MMC5.1 BGA 13 x 11.5 , Industrial (-40C to +85C) Tray Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
Tray
SkyHigh Memory S40FC016C3B1V00000
SkyHigh Memory eMMC 16GB FBGA 13 x 11.5 x 0.8 mm Industrial temp.(-40-105C) Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
Tray
SkyHigh Memory S40FC016C3B1V00300
SkyHigh Memory eMMC 16GB FBGA 13 x 11.5 x 0.8 mm Industrial temp.(-40-105C) Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
Reel
Olimex Ltd. T2-SOM204-1Gs16Me16G-M-I
Olimex Ltd. eMMC SO-DIMM format system on chip module with A20 Dual Core Cortex-A7 processor Non-Stocked
Min.: 1
Mult.: 1
Alliance Memory eMMC eMMC FLASH - NAND (MLC) Memory IC 16GB eMMC_5.1 200 MHz 153-FBGA (11.5x13)- Tray Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

FBGA-153 16 GB MLC 140 MB/s 80 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 40 C + 85 C Tray
Alliance Memory eMMC eMMC FLASH - NAND (MLC) Memory IC 16GB eMMC_5.1 200 MHz 153-FBGA (11.5x13)- Reel Non-Stocked Lead-Time 4 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000
FBGA-153 16 GB MLC 140 MB/s 80 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 40 C + 85 C Reel
ATP Electronics eMMC ATP TLC eMMC V5.1 153b C-Temp - 10GB (pSLC) Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 10 GB SLC - 25 C + 85 C
ATP Electronics eMMC ATP TLC eMMC V5.1 153b C-Temp - 21GB (pSLC) Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 21 GB SLC - 25 C + 85 C
ATP Electronics eMMC ATP TLC eMMC V5.1 153b I-Temp - 21GB (pSLC) Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 21 GB SLC - 40 C + 85 C
ATP Electronics eMMC ATP TLC eMMC V5.1 153b C-Temp 32GB Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 32 GB TLC - 25 C + 85 C
ATP Electronics eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC Non-Stocked Lead-Time 40 Weeks
Min.: 760
Mult.: 760
E600Si FBGA-153 32 GB TLC 290 MB/s 220 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC ATP TLC eMMC V5.1 153b C-Temp - 64GB Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 64 GB - 25 C + 85 C
ATP Electronics eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC Non-Stocked Lead-Time 40 Weeks
Min.: 760
Mult.: 760
FBGA-153 64 GB - 40 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 10 GB PSLC 290 MB/s 140 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 25 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 10 GB PSLC 290 MB/s 140 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 40 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 21 GB PSLC 295 MB/s 215 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 25 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 21 GB PSLC 295 MB/s 215 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 40 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 1,050
Mult.: 1,050
FBGA-153 32 GB 3D TLC 250 MB/s 135 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 25 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 32 GB 3D TLC 270 MB/s 140 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 25 C + 85 C
ATP Electronics eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760
FBGA-153 32 GB 3D TLC 270 MB/s 140 MB/s eMMC 5.1 HS400 2.7 V 3.6 V - 40 C + 85 C